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      HB20-M2

      FEATURES

      Lead-free compatible Halogen free material

      Lower X,Y/Z-axis CTE

      High Tg(230℃,DMA)

      Keeping high modulus in high temperature

      Good punching & Drilling ability 

      Excellent Anti-CAF resistance

      Excellent in Thickness Uniformity

      Excellent in Refractive index and Color consistency


      APPLICATIONS

      Mini & Micro LED 

      Mini & Micro display(HDI)

      Mini RGB PKG(1010, F1010.etc.)

      IC Package

      Memory


      GENERAL PROPERTIES

      Item

      Test method

      Unit

      HB20-M1

      UL No.

      -

      -

      E136069

      UL Flammability

      UL-94

      -

      V-0

      Min Thickness

      UL

      mm

      0.05

      Tg

      DMA

      230

      Td(5%loss)

      10℃/min@N_2

      390

      T260

      TMA

      min

      >60

      T288

      TMA

      min

      Thermal Stress

      288℃, Solder dip

      -

      6 cycles pass

      Z-axis CTE

      Before Tg

      PPM/

      <25

      After Tg

      PPM/

      150

      50-260

      %

      2.0

      X/Y-axis CTE

      Before Tg

      PPM/

      11-13

      After Tg

      PPM/

      5-10

      Thermal conductivity

      ASTM D5470

      W/(m·k)

      0.5

      Moisture Absorption

      D-24/23

      %

      <0.1

      Dielectric Breakdown

      D-48/50+D-0.5/23

      KV

      45KV/mm

      Dielectric constant

      @1GHz

      -

      4.2

      Dissipation Factor

      @1GHz

      -

      0.007

      Peel Strength

      A

      N/mm

      ≥0.80N/mm(@H oz)

      288℃/10S

      ≥0.80N/mm(@H oz)

      Bending strength (LW/CW)

      A

      Mpa

      480/480

      Volume Resistivity

      After moisture

      MΩ-cm

      E-24/125

      Surface resistivity

      After moisture

      MΩ

      E-24/125

      Young’s modulus

      LW

      Gpa

      28

      CW

      Gpa


      SPECIFICATIONS

      Standard Size

      1041mm*1244mm

      Circuit layer(Electrolytic copper foil)

      12μm

      18μm

      35μm

      70μm

      105μm


      Line up of Core Material

      Thickness(mm)

      Glass fabrics ply

      0.03

      1*1037

      0.04

      1*1067

      0.05

      1*1078

      0.065

      2*1037

      0.07

      2*106

      0.10

      2*1078

      0.15

      3*1078

      0.20

      2*2116

      0.30

      3*2116

      0.40

      4*2116

      0.50

      5*2116

      0.60

      6*2116

      0.80

      8*2116

      1.00

      10*2116

      1.20

      12*2116

      1.50

      8*7628

       

      Line up of PP material

      Thickness(mm)

      Glass fabrics

      Resin Content

      0.035-0.004mm

      1027

      70%

      0.045-0.05mm

      1037

      71%

      0.055-0.06mm

      1067

      70%

      0.065-0.07mm

      1067

      74%

      0.075-0.08mm

      1078

      65%

      0.085-0.09mm

      1078

      68%

      0.12-0.125mm

      2116

      54%